OCP APAC Summit Registration is Open!
Registration is open for the 2025 OCP APAC Summit! This event will bring together APAC communities for a very special two-day, in-person Summit to explore the many challenges and opportunities facing data center and edge infrastructure today, and tomorrow.
The OCP APAC Summit will showcase the latest innovations and technical advancements from around the world. The Summit will feature talks from experts who are researching and designing the next generation of hyperscale data center and edge facilities and infrastructure, as well as an exhibit bringing together buyers and vendors.
OCP APAC Summit Schedule Overview
Call for Presentations are open!
The 2025 OCP APAC Summit Call for Presentations is organized as seven main categories: AI Clusters, Chiplets and Advanced Packaging / Photonics, Adoption of OCP-Recognized Equipment & Facilities, Future Technologies Symposium, Cooling Environments, Optical Communication Networks, Server, Networking, Storage and Rack & Power. OCP invites speakers to submit proposals - more details can be found on our website.
Important Deadlines:
• April 1: Call for Presentations Opens
• May 19: Call for Presentations Closes
• Week of June 2: Speakers Notified - accept or reject
• June 23: Draft Presentations Due to OCP
• June 24 - July 7: Presentation Review Period
• July 28: Final Presentations Due
• August 5 - 6: OCP APAC Summit
OCP Breakout Session Presentation Acceptance Criteria:
• Preferably discuss work done collaboratively within OCP Projects
• Must discuss work done in the open, not proprietary or containing confidential information
• Might discuss work that is adjacent to OCP Projects and relevant to the OCP Community
• Should report on engineering or scientific results, must not be commercial
• Must be prepared to meet submission deadlines (above)
For more details, please refer to the website: https://www.opencompute.org/summit/2025-ocp-apac-summit/call-for-presentations
