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[轉知會員活動]首屆 TIARA-IEEE SYW Seminar in Taiwan 隆重登場(10/16 -- 台北)

  • 發布時間: 2025-09-17
  • 資料來源: 台灣人工智慧晶片聯盟
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首屆 TIARA-IEEE SYW Seminar in Taiwan 隆重登場(10/16 -- 台北)

1st TIARA-IEEE SYW Seminar in Taiwan

 Innovation for Lightweight AI: Technology and Applications

 

 

Vision: Connecting International Tech Talents

Mission: Engaging global SYW with industry, academia and research professionals worldwide

[ Registration  ]: https://ievents.iii.org.tw/JoinPNew.aspx?t=0&id=2969

About the Seminar

The 1st TIARA-IEEE SYW Seminar in Taiwan is a landmark event focused on "Innovation for Lightweight AI: Technology and Applications". This hybrid seminar aims to bridge global Students, Young Professionals, and Women in Engineering with leading industry, academia, and research professionals worldwide.

Co-organized by TIARA (Taiwan Industry-Academia Research Alliance), IEEE Taipei Section, and IEEE Tainan Section, this seminar strengthens partnerships, builds a vital talent platform, and enhances Taiwan's global visibility in the critical domains of semiconductors, IC design, and AI.

 

Highlights of the Event

Pioneering Event: This is the first-ever TIARA-IEEE SYW Seminar in Taiwan, emphasizing cross-sector and international talent connection. It will be held in a hybrid format, with an estimated 80 attendees onsite and 1,000 online.

Part of IEEE Day Worldwide: This seminar is proudly connected to IEEE Day, an annual global event celebrating the historic gathering of engineers in 1884 to share technical ideas. It showcases how IEEE members collaborate to leverage technology for a better tomorrow.

Co-located with TIE (Taiwan InnoTech EXPO): The seminar is strategically co-located with the Taiwan InnoTech EXPO 2025 (TIE), a premier one-stop exhibition for innovation resources. TIE brings together 11 government departments and councils, features over 430 participating companies and 20+ exhibitors from more than 20 countries, showcasing over 1,000 innovative technologies [As per previous conversation history]. For more information about TIE 2025, please visit: https://tie.twtm.com.tw/en

Engaging Leaders and Representatives: We are honored to welcome eminent leaders from IEEE Region 10 and host international and local SYW representatives for insightful short talks and panel discussions.

 

Target Audience

This seminar is specifically designed for:

SYW attendees: Students, Young Professionals, Women in Engineering

Industry, academia, and research professionals in the fields of semiconductors, IC design, and AI.

[ Registration ] https://ievents.iii.org.tw/JoinPNew.aspx?t=0&id=2969 

 

Event Information

Date: October 16, 2025 (Thursday)

Venue: South Lounge, 3F, Taipei International Convention Center (TICC), Taiwan

Format: Hybrid (Onsite & Online)

Onsite participation: 80 seats

Online participation: [the broadcast link will be announced in early Oct.]

 

Agenda (09:30~12:20)(UTC+8 Taipei Time)

 

Organizing Units

Guided by: Industrial Development Agency (IDA), Ministry of Economic Affairs (MOEA)

Co-organized by:

Institute for Information Industry (III) under the iCiE Program

Taiwan IC Industry and Academia Research Alliance (TIARA)

IEEE Taipei Section

IEEE Tainan Section

 

In collaboration with:

National Yang Ming Chao Tung University (NYCU)

National Cheng Kung University (NCKU)

National University of Kaohsiung (NUK)

 

Organizing Committee

Advisory Board:

Prof./Dr. Shih-Chien Chang

Prof./Dr. Shawn Shuo-Hung Hsu

Prof./Dr. Li-Chun Wang

Prof./Dr. Pei-Yin Chen

General Chair & Co-Chairs:

Prof./Dr. Chris Gwo-Giun Lee

Prof./Dr. Pei-Wen Li

Prof./Dr. Meng-Hsueh Chiang

Prof./Dr. Chuen Yau Chen

Executive Chair:

Dr. Jeng-Long Chiang

Program Co-Chairs:

Prof./Dr. Yu-Te Liao

Prof./Dr. Kun-Chih Chen

 WIE Chair:

Prof./Dr. Wei-Chen Tu

Secretariat:

Grace Wang

Summer Lee

Renie Hung

 

Contact Us

TIARA,Email: tiaratwic@gamil.com

Phone: +886-35912777

 

IEEE Taipei Section,Email: ie3taipeisection@gmail.com

Phone: +886-35712121 ext.54484 / 31590

 

IEEE Tainan Section,Email: tainansection.ieee@gmail.com

Phone: +886-62757575 ext.62552

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